“The Area Array Packaging Handbook” brings you the details you need on this rapidly expanding field in microelectronics packaging.Filled with hands-on, leading edge information engineers need for day-to-day decision making, “Area Array Packaging Handbook” is an unbeatable resource for success in today’s fast-paced world of HDI. Look for these highlights inside: the hottest technologies in electronics packaging – BGA, CSP, and Flip Chip – all in one reference; details on MEMs technology; pros and cons of each technology in various applications; solutions for difficult packaging ramifications of HDI design concepts; detailed coverage of critical reliability and testing issues; help with design, materials, and manufacturing processes; problem-solving approaches to conception, construction, assembly, and applications; world-class expert contributors; and, 400 illustrations. It covers advances, applications, concepts, design, economics, opimization, equipment, future, technology, materials, processes, and productivity.

Look for these highlights inside:
*The hottest technologies in electronics packaging–BGA, CSP, and Flip Chip–all in one reference
*Details on MEMs technology
*Pros and cons of each technology in various applications
*Solutions for difficult packaging ramifications of HDI design concepts
*Detailed coverage of critical reliability and testing issues
*Help with design, materials, and manufacturing processes
*Problem-solving approaches to conception, construction, assembly, and applications
*World-class expert contributors
*400 illustrations
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