May 18
Packaging Handbook: Manufacturing and Assembly">Area Array Packaging Handbook: Manufacturing and Assembly
“The Area Array Packaging Handbook” brings you the details you need on this rapidly expanding field in microelectronics packaging.Filled with hands-on, leading edge information engineers need for day-to-day decision making, “Area Array Packaging Handbook” is an unbeatable resource for success in today’s fast-paced world of HDI. Look for these highlights inside: the hottest technologies in [...]